Sil-Pad K10 is a special film to the substrate, high performance elastomeric insulation material with excellent cut resistance and excellent thermal conductivity. Is widely used in electrical and electronic industries. When used, depending on the size and height of the interface gap fever select thermal silica films with different thickness cut, placed in the gap at the interface of its components heat, from the role of a heat transfer medium.

Sil-Pad K10是一種以特殊薄膜為基材的高性能彈性體絕緣材料，具有優(yōu)良的抗切割能力和極好的導熱性能。被廣泛應(yīng)用于電子電器等行業(yè)。使用時，根據(jù)發(fā)熱界面的大小及間隙高度選擇不同厚度的導熱硅膠片裁切，安放在發(fā)熱界面與其組件的空隙處，起導熱介質(zhì)作用。

Features 特性：                            

. Thermal conductivity 熱傅導率: 0.9W/m-K、1.1W/m-K、1.3W/m-K

. High pressure resistance  耐高壓

. High dielectric strength  絕緣強度高

. Durable 耐用

Applications 產(chǎn)品應(yīng)用端：

. Power Supplies  電源

.  Motor Control  馬達控制

.  Power semiconductors  功率半導體

Performance parameters 性能參數(shù)：