LBD-PC thermal potting fast curing, high thermal conductivity, low coefficient of expansion, excellent electrical insulation properties, in a wide range of temperature and humidity changes, long-term, reliable protection of sensitive circuits and components has excellent electrical insulation, moisture-proof and waterproof certain flame retardant properties, can withstand environmental pollution, to avoid damage due to stress and vibration and humidity and other environmental factors on the product caused, especially for heat dissipation requirements of the potting material good product. The product has excellent physical and chemical resistance, minimal shrinkage, thermal curing process and hold no solvents or cure byproducts, with repair, can solidify into elastomer deep.

LBD-PC導(dǎo)熱灌封膠能快速固化，高導(dǎo)熱，膨脹系數(shù)低，電氣絕緣性能優(yōu)越，在大范圍的溫度及濕度變化內(nèi),可長期可靠保護敏感電路及元件具有優(yōu)良的電絕緣、防潮防水及一定的阻燃性能，能抵受環(huán)境污染，避免由于應(yīng)力和震動及潮濕等環(huán)境因素對產(chǎn)品造成的損害,尤其適用于對灌封材料要求散熱性好的產(chǎn)品。該產(chǎn)品具有優(yōu)良的物理及耐化學(xué)性能，極小的收縮性，固化過程中不放熱沒有溶劑或固化副產(chǎn)物,具有可修復(fù)性 ，可深層固化成彈性體。

Features 特性：                            

. Thermal conductivity 熱傅導(dǎo)率: 1.0 W/m-K

. Superior resistance to high temperature resistance  優(yōu)越的耐高低溫性

.  Power module. Chemical stability and mechanical properties  功率模塊、化學(xué)性能和機械性能穩(wěn)定

Applications 產(chǎn)品應(yīng)用端：                     Product Configuration  產(chǎn)品配置： 

. Power Modules 電源模塊                           . 5 KG/Pot  5 KG/罐

.  LED drive power LED 驅(qū)動電源                                       .  10 KG/Pot   10 KG/罐

.  Telecommunications equipment  電信設(shè)備

.  Integrated chips  集成芯片

Material property  材料特性：