LBD-GP3000 Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

LBD-GP3000 系列熱傳導(dǎo)界面材料是填充發(fā)熱器件和散熱片或金屬底座之間的空氣間隙，它們的柔性、彈性特征使其能夠用于覆蓋非常不平整的表面。熱量從分離器件或整個(gè)PCB傳導(dǎo)到金屬外殼或擴(kuò)散板上，從而能提高發(fā)熱電子組件的效率和使用壽命。

Features 特性：                                   Applications 產(chǎn)品應(yīng)用端：

.Thermal conductivity 熱傅導(dǎo)率: 3.0W/m-K           . Computer services: CPU, Heat sink, Memory modules

. Very soft & high compressibility 超軟及高壓縮性   . LED Lighting, LCD-TV

. Natural tacky 自黏性                             . Military Electronics

. Good Electrically isolating 高耐電壓             . Power Supplies

. Easy to assembly 易於施工                         . Telecom services, Wireless instruments

. Cost effective 價(jià)格合理                          . Automotive control services  

Material property 材料特性：